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All three materials are glass fiber–reinforced epoxy laminates, so their densities are very similar:
| Material | Density (g/cm³) | Notes |
|---|---|---|
| FR4 | 1.85–2.0 (typical 1.9) | Contains flame-retardant additives; UL94 V-0 |
| G10 | 1.80–2.0 (typical 1.9) | No flame retardant; mechanically stable |
| G11 | 1.85–2.0 (typical 1.95) | Enhanced high-temperature performance; Class F (155°C) |
Summary: The densities are nearly identical, with G11 slightly higher on average.
All three materials are low thermal-conductivity insulation laminates:
| Material | Thermal Conductivity (W/m·K) | Notes |
|---|---|---|
| FR4 | 0.25–0.35 (typical 0.29) | Flame-retardant; low thermal conductivity |
| G10 | 0.25–0.30 | Similar to FR4, without flame retardant |
| G11 | 0.28–0.35 | More stable at high temperature; slightly higher thermal conduction |
Summary: G11 > FR4 ≥ G10 in thermal conductivity (differences are small).
| Performance | FR4 | G10 | G11 |
|---|---|---|---|
| Flame Retardancy | ★★★ (UL94 V-0) | ★ (Non-FR) | ★ (Non-FR) |
| Temperature Class | 130°C (Class B) | 130°C (Class B) | 155°C (Class F) |
| Mechanical Strength | Stable | Slightly higher than FR4 | Most stable at high temperature |
| Typical Applications | PCB, electrical insulation | Industrial structural parts, insulation | High-temp, high-insulation, high-frequency applications |
Density: Nearly the same for all three materials (1.85–2.0 g/cm³).
Thermal Conductivity: 0.25–0.35 W/m·K, with G11 slightly higher.
G11 offers the best high-temperature performance.
FR4 offers flame retardancy.
G10 is a general-purpose mechanical grade.
